ECP finalizes a R&D project bringing forward a huge step the state of the art of decontamination: cleaning down to 50nm. Our new cleaning line is able to meet very high cleanliness specifications that standard cleaning processes are not capable to. The defined objective is 50 times less than our current specifications. These requirements match specifications coming from 450mm semiconductor technologies and EUV photolithographic processes. ECP will be one of the first service providers in Europe to achieve this level of cleaning.