ECP has participated at the kick-off meeting of the European project MADEin4 (Metrology Advances for Digitized ECS industry 4.0), that took place at Tel-Aviv, Israel 29 & 30/04/2019. In the frame of this project, ECP will evaluate advanced cleaning techniques as for wafer slots of boxes and carriers in order to limit contamination risk at the silicon wafer cutting edge. It is a collaborative project, lead by Applied Materials Israel, for a duration of 3 years. This projects benefits from the European program ECSEL-JU as well as from the Ministry of Economic and Financial Affairs for the French companies.
